Normy DIN - Německé národní normy - strana 16990

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (includes Amendment A1:2000).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury..)

NEPLATNÁ vydaná dňa 1.3.2001

Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures.

NEPLATNÁ vydaná dňa 1.10.2002

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT).

NEPLATNÁ vydaná dňa 1.11.2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling.

NEPLATNÁ vydaná dňa 1.4.2014

Test methods for electronic circuit board for high-brightness LEDs.

NEPLATNÁ vydaná dňa 1.1.2012

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs.

NEPLATNÁ vydaná dňa 1.9.2014

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 3: Zkušební metody pro propojovací struktury (desky s plošnými spoji)..)

NEPLATNÁ vydaná dňa 1.10.1997

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 3: Zkušební metody pro propojovací struktury (desky s plošnými spoji)..)

NEPLATNÁ vydaná dňa 1.8.2000

Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures.

NEPLATNÁ vydaná dňa 1.11.2002

Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks.

NEPLATNÁ vydaná dňa 1.10.2014