Normy DIN - Německé národní normy - strana 16989

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance.

NEPLATNÁ vydaná dňa 1.9.2022

Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator.

NEPLATNÁ vydaná dňa 1.11.2013

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials.

NEPLATNÁ vydaná dňa 1.4.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board.

NEPLATNÁ vydaná dňa 1.5.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300.

NEPLATNÁ vydaná dňa 1.5.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA.

NEPLATNÁ vydaná dňa 1.3.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA.

NEPLATNÁ vydaná dňa 1.12.2020

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method.

NEPLATNÁ vydaná dňa 1.3.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA.

NEPLATNÁ vydaná dňa 1.3.2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures.
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury..)

NEPLATNÁ vydaná dňa 1.10.1997