Normy DIN - Německé národní normy - strana 16988

Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design.

NEPLATNÁ vydaná dňa 1.12.2017

Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction.

NEPLATNÁ vydaná dňa 1.11.2007

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction.
(Desky s plošnými spoji a osazené desky - Návrh a použití - Část 7: Nulová orientace elektronických součástek pro konstrukci knihovny CAD. .)

NEPLATNÁ vydaná dňa 1.12.2009

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction.

NEPLATNÁ vydaná dňa 1.5.2016

Component shape data specification for CAD library - Part 8-1: Generic Descriptions of the 2D and 3D description.

NEPLATNÁ vydaná dňa 1.7.2009

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology.
(Zkušební metody pro elektrotechnické materiály, desky s plošnými spoji a jiné propojovací struktury a sestavy - Část 1: Všeobecné zkušební metody a metodiky.)

NEPLATNÁ vydaná dňa 1.10.1997

Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys.

NEPLATNÁ vydaná dňa 1.11.2009

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials.

NEPLATNÁ vydaná dňa 1.12.2020

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning.

NEPLATNÁ vydaná dňa 1.11.2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500 MHz to 10 GHz).

NEPLATNÁ vydaná dňa 1.2.2015