Printed boards and printed board assemblies. Design and use. Part 5-3. Attachment (land/joint) considerations. Components with gull-wing leads on two sides

Norma vydaná dňa 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides

Norma vydaná dňa 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-5. Attachment (land/joint) considerations. Components with gull-wing leads on four sides

Norma vydaná dňa 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-6. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides

Norma vydaná dňa 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

Norma vydaná dňa 1.3.2015

Printed boards and printed boards assemblies. Design and use. Part 7. Electronic component zero orientation for CAD library construction

Norma vydaná dňa 1.7.2018

Test methods for electrical materials, interconnection structures and assemblies. Part 1. General test methods and methodology

Norma vydaná dňa 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2. Test methods for materials for interconnection structures

Norma vydaná dňa 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3. Test methods for interconnection structures (printed boards)

Norma vydaná dňa 1.3.2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-1. General test methods for materials and assemblies. Guidance for printed board assemblies

Norma vydaná dňa 1.6.2020