Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Norma vydaná dňa 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Norma vydaná dňa 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
K dispozici od: únor 2027

Norma vydaná dňa 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Norma vydaná dňa 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Norma vydaná dňa 31.12.2025

Mechanical standardization of semiconductor devices—Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
K dispozici od: březen 2027

Norma vydaná dňa 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
K dispozici od: březen 2027

Norma vydaná dňa 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
K dispozici od: únor 2027

Norma vydaná dňa 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ
K dispozici od: únor 2027

Norma vydaná dňa 30.7.2026

Medical glass thermometer

Norma vydaná dňa 29.4.2024