Directives for drafting semiconductor facilities interface specification

Norma vydaná dňa 22.12.1995

General specification for trunked mobile communication system

Norma vydaná dňa 22.12.1995

General specification for leaky cable radiocommunication system

Norma vydaná dňa 22.12.1995

Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

Norma vydaná dňa 15.5.2015

Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

Norma vydaná dňa 31.12.2013

Semiconductor integrated circuits—Specification of leadframes for small outline package

Norma vydaná dňa 15.5.2015

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Norma vydaná dňa 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Norma vydaná dňa 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Norma vydaná dňa 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)
K dispozici od: červenec 2026

Norma vydaná dňa 31.12.2025