Normy DIN - Německé národní normy - strana 19554

Test method of ultrasonic cleaning; exposure of surface mounting devices; identical with IEC 91(Secretariat)26:1993.

NEPLATNÁ vydaná dňa 1.8.1993

Test methods for soldering of surface mounting devices (SMDs); identical with IEC 91(Secretariat)27:1993.

NEPLATNÁ vydaná dňa 1.9.1993

Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies; identical with IEC 91(Secretariat)28:1993.

NEPLATNÁ vydaná dňa 1.9.1993

Guidance document: Standard method for the specification for surface mounting components (SMDs) of assessed quality.

NEPLATNÁ vydaná dňa 1.10.1994

Registration and analysis of defects on printed board assemblies.

NEPLATNÁ vydaná dňa 1.6.1997

IEC 61761: Generic specification - Capability approval for surface mount technologies.

NEPLATNÁ vydaná dňa 1.12.1997

IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly.

NEPLATNÁ vydaná dňa 1.11.1998

Attachment materials for electronics assemblies - Part 1-2: Requirements for soldering paste fluxes for high quality; interconnections in electronics assembly.

NEPLATNÁ vydaná dňa 1.11.1998

IEC 61190-1-3: Requirements for electronic grade solder alloys and fluxed or non-fluxed solid solders for electronic soldering application.

NEPLATNÁ vydaná dňa 1.12.1998

IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies.

NEPLATNÁ vydaná dňa 1.3.1999