Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-40: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees en tissu de verre de type E epoxyde non halogene a haute performance, plaquees cuivre, d´inflammabilite definie (essai de combustion verticale), pour les assemblages sans plomb)

Norma vydaná dňa 29.11.2012

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-41: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de verre de type E/papier cellulose epoxyde brome, plaquees cuivre, d´inflammabilite definie (essai de combustion verticale) pour les assemblages sans plomb)

Norma vydaná dňa 21.4.2010

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-42: Materiaux de base renforces plaques et non plaques - Feuilles stratifiees renforcees en verre de type E epoxyde brome tisse/non tisse, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre pour les assemblages sans plomb)

Norma vydaná dňa 21.4.2010

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-43: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en verre de type E tisse/papier cellulose epoxyde non halogene, plaquees cuivre, d´inflammabilite definie (essai de combustion verticale) pour les assemblages sans plomb)

Norma vydaná dňa 12.5.2016

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-44: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en verre de type E tisse/non-tisse epoxyde non halogene, plaquees cuivre, d´inflammabilite definie (essai de combustion verticale) pour les assemblages sans plomb)

Norma vydaná dňa 12.5.2016

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-45: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en verre de type E tisse/non tisse epoxyde non halogene, de conductivite thermique 1,0 W/(m•K) et d´inflammabilite definie (essai de combustion verticale), plaquees cuivre pour les assemblages sans plomb)

Norma vydaná dňa 10.1.2018

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-46: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en verre de type E tisse/non tisse epoxyde non halogene, de conductivite thermique 1,5 W/(m•K) et d´inflammabilite definie (essai de combustion verticale), plaquees cuivre pour les assemblages sans plomb)

Norma vydaná dňa 10.1.2018

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 2-47: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en verre de type E tisse/non tisse epoxyde non halogene, de conductivite thermique 2,0 W/(m•K) et d’inflammabilite definie (essai de combustion verticale), plaquees cuivre pour les assemblages sans plomb)

Norma vydaná dňa 10.1.2018

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-5: Materiaux de base renforces, plaques et non-plaques - Feuilles stratifiees avec couches centrales renforcees en papier cellulose epoxyde brome et couches superficielles renforcees en tissu de verre de type E epoxyde, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Norma vydaná dňa 12.11.2003

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
(Materiaux pour circuits imprimes et autres structures d’interconnexion - Partie 2-51: Materiaux de base renforces, plaques et non plaques - Materiaux de base pour bande support de carte a circuit integre, non plaques)

Norma vydaná dňa 11.5.2023