Materials used in photovoltaic (PV) cells - Part 1: Specifications for electrical characteristics of crystalline silicon wafers

Norma vydaná dňa 5.3.2026

Quantification and communication of carbon footprint, GHG emission reductions and avoided emissions from electric and electronic products and systems - Principles, methodologies, requirements and guidance
(Quantification et communication de l´empreinte carbone, des reductions d´emissions de GES et des emissions evitees des produits et systems electriques et electroniques - Principes, methodologies, exigences et recommandations)

Norma vydaná dňa 20.1.2026

Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
(Lignes directrices pour les methodes d’essai de resistance dynamique a l’etat passant des dispositifs de conversion de puissance fondes sur les HEMT en GaN)

Norma vydaná dňa 10.2.2022

Nuclear power plants - Instrumentation systems important to safety - Characteristics and test methods of nuclear reactor reactivity meters
(Centrales nucleaires - Systemes d´instrumentation importants pour la surete - Caracteristiques et methodes d´essai des reactimetres d´un reacteur nucleaire)

Norma vydaná dňa 10.10.2025

Industrial facility energy management system (FEMS) - Functions and information flows
(Systeme de gestion d´energie des installations industrielles (FEMS) - Fonctions et flux d’informations)

Norma vydaná dňa 16.8.2023

Procedures for the assessment of human exposure to electromagnetic fields from radiative wireless power transfer systems – Measurement and computational methods (frequency range of 30 MHz to 300 GHz)

Norma vydaná dňa 4.11.2022

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Norma vydaná dňa 14.12.2021

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

Norma vydaná dňa 22.10.2024

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
(Normalisation thermique des boitiers de semiconducteurs - Partie 3: Modeles de simulation de circuits thermiques de boitiers de semiconducteurs discrets pour analyse transitoire)

Norma vydaná dňa 6.5.2025

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
(Normalisation thermique des boitiers de semiconducteurs - Partie 6: Modele de resistance thermique et de capacite pour la prediction de la temperature transitoire aux points de jonction et de mesure)

Norma vydaná dňa 4.2.2026