Cookies
Potrebujeme váš súhlas na využitie jednotlivých dát, aby sa vám okrem iného mohli ukazovať informácie týkajúce sa vašich záujmov. Súhlas udelíte kliknutím na tlačidlo „OK“.
ISO/TS 10303-1686:2018-ed.5.0
Industrial automation systems and integration — Product data representation and exchange — Part 1686: Application module: Interconnect module usage view
NORMA vydaná dňa 18.12.2018
| Dostupnosť | SKLADOM |
| Cena | NA OTÁZKU bez DPH |
| NA OTÁZKU |
Informácie o norme:
Označenie normy: ISO/TS 10303-1686:2018-ed.5.0
Dátum vydania normy: 18.12.2018
Kód tovaru: NS-943533
Približná hmotnosť: 300 g (0.66 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy ISO
Kategórie - podobné normy:
Anotácia textu normy ISO/TS 10303-1686:2018-ed.5.0 :
Description / Abstract: ISO/TS 10303-1686:2018-11 specifies the application module for Interconnect module usage view. The following are within the scope of ISO/TS 10303-1686:2018-11: the representation of the information needed to describe the interface definition of the interconnect substrate. This view may be used for the purpose of electrical and mechanical simulation and verification of the interconnect substrate performance when applied in the next level of assembly. Complex features including cavities and cutouts are predefined as well as industry standard edge treatments. The usage view may be treated as a requirement definition by a design organization with links established to relevant design details in an unpublished model maintained by that design organization. The usage view is a predefined model of a subset of documentation classified as interface control documententation. interconnect substrate features used for next level design;interconnect substrate cavities;interconnect substrate cutouts;interconnect substrate orientation information;interconnect substrate terminals;interconnect substrate thickness requirement;interconnect substrate features that may be accessible from the exterior of the end item;interconnect substrate terminals that are internally connected;interconnect substrate terminal identification;geometric dimensioning and tolerancing.
Doporučujeme:
