Potrebujeme váš súhlas na využitie jednotlivých dát, aby sa vám okrem iného mohli ukazovať informácie týkajúce sa vašich záujmov. Súhlas udelíte kliknutím na tlačidlo „OK“.
IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
NORMA vydaná dňa 13.3.2020
Označenie normy: IEEE 1838-2019
Dátum vydania normy: 13.3.2020
Kód tovaru: NS-988463
Počet strán: 99
Približná hmotnosť: 328 g (0.72 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEEE
New IEEE Standard - Active.
IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding
ISBN: 978-1-5044-6343-0, 978-1-5044-6344-7
Number of Pages: 99
Product Code: STD23997, STDPD23997
Keywords: 3D test access, flexible parallel port, FPP, IEEE 1838, multi-tower stack, primary test access port, scan, secondary test access port, test, through-silicon via, TSV
Category: Measurement Instruments and Techniques|Test Technology
Posledná aktualizácia: 2024-07-29 (Počet položiek: 2 339 192)
© Copyright 2024 NORMSERVIS s.r.o.