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Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)
Automaticky preložený názov:
Štandardná skúšobná metóda pre meranie Priľnavosť Pevnosť spájkovateľný filmov na substráty ( Withdrawn 2008 )
NORMA vydaná dňa 10.12.2002
Označenie normy: ASTM F692-97(2002)
Poznámka: NEPLATNÁ
Dátum vydania normy: 10.12.2002
Kód tovaru: NS-56136
Počet strán: 7
Približná hmotnosť: 21 g (0.05 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM
Keywords:
adhesion strength, metallization, solderable thick film, ICS Number Code 25.160.50 (Brazing and soldering)
Significance and Use |
Failure of hybrid microcircuits is often due to failure of a solder bond. The limiting strength that can be obtained for a solder bond is often the adhesion of the soldered film to the substrate. This test method can be used for material selection, process development, research in support of improved yield or reliability, and specification for material procurement. It is not recommended that this test method be used in deciding questions between buyers and sellers until the precision of the method has been determined by interlaboratory comparison. |
1. Scope |
1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films. 1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder. 1.3 This test method applies to all films that can be soldered. 1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux. 1.5 This test method is destructive. 1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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