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Standard Test Method for Bow of Silicon Wafers
Automaticky preložený názov:
Štandardná skúšobná metóda pre Bow kremíkových dosiek
NORMA vydaná dňa 10.1.2002
Označenie normy: ASTM F534-97
Poznámka: NEPLATNÁ
Dátum vydania normy: 10.1.2002
Kód tovaru: NS-55634
Počet strán: 3
Približná hmotnosť: 9 g (0.02 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM
Keywords:
bow, silicon, wafers, ICS Number Code 29.045 (Semiconducting materials)
1. Scope |
1.1 This test method covers determination of the average amount of bow of nominally circular silicon wafers, polished or unpolished, in the free (non-clamped) condition. 1.2 This test method is intended primarily for use with wafers that meet the dimension and tolerance requirements of SEMI Specifications M1. 1.3 This test method can also be applied to circular wafers of other semiconducting materials, such as gallium arsenide, or electronic substrate materials, such as sapphire or gadolinium gallium garnet, that have a diameter of 25 mm or greater, a thickness of 0.18 mm or greater, and a ratio of diameter to thickness up to 250. Wafers to be tested may have one or more fiducial flats provided they are located in such a way that the slice can be centered on the support pedestals (see 7.1.2) without falling off. 1.4 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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