Cookies
Potrebujeme váš súhlas na využitie jednotlivých dát, aby sa vám okrem iného mohli ukazovať informácie týkajúce sa vašich záujmov. Súhlas udelíte kliknutím na tlačidlo „OK“.
ASTM F533-96
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
Automaticky preložený názov:
Štandardná skúšobná metóda pre hrúbky a hrúbky Variácie kremíkových dosiek
NORMA vydaná dňa 10.1.2002
Informácie o norme:
Označenie normy: ASTM F533-96
Poznámka: NEPLATNÁ
Dátum vydania normy: 10.1.2002
Kód tovaru: NS-55631
Počet strán: 4
Približná hmotnosť: 12 g (0.03 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM
Anotácia textu normy ASTM F533-96 :
Keywords:
semiconductor, silicon, thickness, thickness variation, total thickness variation, wafer, ICS Number Code 29.045 (Semiconducting materials)
Doplňujúce informácie
| 1. Scope |
|
1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is intended primarily for use with wafers that meet the dimension and tolerance requirements of SEMI Specifications M1. However, it can be applied to circular silicon wafers, or substrates of any diameter and thickness that can be handled without breaking. 1.3 This test method is suitable for both contact and contactless gaging equipment. Precision statements have been established for each. 1.4 The values stated in inch-pound units are to be regarded as standard. The values in parentheses are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
Doporučujeme:
