ASTM D5651-95a(2002)

This test method provides a measure of the bond quality of the fibers, or particles, at the surface of wood-base fiber and particle panel materials including particleboard; medium-density fiberboard (MDF); oriented strand board (OSB); and waferboard. Surface bond strength is a measure of the strength and resistance to delamination of the bond between overlay materials and panel surfaces and is an important consideration when these overlay materials, such as wood veneers, saturated papers, or plastic overlays, are to be bonded to the panel surface during secondary manufacturing.

1.1 This test method is a measure of the cohesive bond strength of the fibers, or particles, on the surface of wood-base fiber and particle panels (for example, particleboard and medium-density fiberboard) in the direction perpendicular to the plane of the panel.

1.1.1 To determine the internal cohesive bond strength of wood-base fiber and particle panels, use Sections 28 through 33 of Test Methods D 1037.

1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.