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ASTM D5109-99(2004)
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
Automaticky preložený názov:
Štandardné testovacie metódy pre medené termosety lamináty na doskách s plošnými spojmi
NORMA vydaná dňa 10.10.1999
Informácie o norme:
Označenie normy: ASTM D5109-99(2004)
Poznámka: NEPLATNÁ
Dátum vydania normy: 10.10.1999
Kód tovaru: NS-29870
Počet strán: 8
Približná hmotnosť: 24 g (0.05 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM
Anotácia textu normy ASTM D5109-99(2004) :
Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)
Doplňujúce informácie
| 1. Scope | ||||||||||||||||||||||||
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1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards. 1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1.1, 8.1.1, and 11.3.1. 1.3 Metric units are the preferred units for this standard. Inch pound units, where shown, are presented for information only. 1.4 The procedures appear in the following sections: Procedure Section Referenced Documents 2 Conditioning 4 Dielectric Breakdown Voltage Parallel to Laminations 13 Dimensional Instability 19 Dissipation Factor 14 Flammability Rating Test 16 Flexural Strength, Flatwise at Elevated Temperature 15 Flexural Strength, Flatwise at Room Temperature 15 Oven Blister Test 17 Peel Strength Test at Elevated Temperature 10 Peel Strength Test at Room Temperature 9 Permittivity 14 Pin Holes in Copper Surface 20 Purity of Copper 5 Scratches in Copper Surface 21 Solder Float Test 8 Solvent Resistance 7 Surface Resistivity 11 Volume Resistivity 11 Terminology 3 Thickness ∧ Thickness Variation 18 Warp or Twist 6 Water Absorption 12 |
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| 2. Referenced Documents | ||||||||||||||||||||||||
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