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Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
Automaticky preložený názov:
Štandardné skúšobné metódy pre medené na termosety dosky pre doskách s plošnými spojmi
NORMA vydaná dňa 1.11.2012
Označenie normy: ASTM D5109-12
Poznámka: NEPLATNÁ
Dátum vydania normy: 1.11.2012
Kód tovaru: NS-29869
Počet strán: 9
Približná hmotnosť: 27 g (0.06 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM
Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)
1. Scope | ||||||||||||||||||||||||||||||||||||||||||||||||
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards. 1.2 The procedures appear in the following sections:
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1. |
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2. Referenced Documents | ||||||||||||||||||||||||||||||||||||||||||||||||
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