ASTM D3808-01(2013)

5.1 This is a quick, simple, and inexpensive test method for qualitatively determining, without the need to prepare bonded test specimens, whether the adhesive under consideration will bond to a particular substrate. If the results are acceptable, then standard quantitative adhesive test procedures can be used to obtain quantitative measurements of the adhesive's performance.

5.2 This test method can also be used to compare relative adhesion of several adhesives to given substrates.

5.3 It can be used to determine whether an adhesive will continue to adhere to the substrate under specified environmental conditions.

5.4 It can be used to evaluate adhesion of a particular adhesive to a variety of substrates.

5.5 It can be used to obtain “subjective” comparative data between several adhesives on a given substrate by noting the relative ease of inducing failure between the adhesives tested.

5.6 It should be most applicable to adhesives that cure or set when exposed to “air” (ambient, heated, etc.) and could be used for anaerobic adhesives if testing is carried out in an oxygen-free atmosphere.

1.1 This test method covers a simple qualitative procedure for quickly screening whether an adhesive will, under recommended application conditions, bond to a given substrate without actually making bonded assemblies.

1.2 The values stated in SI units are to be regarded as the standard. The values in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.