ASTM B490-92(2003)

This practice is useful as one method of controlling some electroplating solutions. It serves to indicate the presence of contamination or some other adverse condition.

Ductility measurements are of particular value when electroplated parts are to be subjected to moderate stress such as that involved in bolting an electroplated bumper to an automobile.

Note 1—The foils used in this practice are typically 25 to 40 μm thick. Foils in this thickness range do not have the same properties as bulk metal. For example, a nickel electrodeposit 0.5 mm thick, prepared in purified bright nickel electroplating solutions for which this test is being used, had less than 3 % elongation in a tension test, and could not be bent to a 90° angle without complete fracture. However, foils 25 to 40 μm thick, electroplated at the same time, had micrometer ductility values in the 10 to 25 % range.

1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.