Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die
NORMA vydaná dňa 18.12.2018
Designation standards: ISO/TS 10303-1650:2018-ed.5.0
Publication date standards: 18.12.2018
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Kategória: Technické normy ISO
Description / Abstract: ISO/TS 10303-1650:2018-11 specifies the application module for Bare die. The following is within the scope of ISO/TS 10303-1650:2018-11: The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package. definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.