Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
NORMA vydaná dňa 20.3.2019
Označenie normy: IEC/TR 62878-2-7-ed.1.0
Dátum vydania normy: 20.3.2019
Počet strán: 12
Približná hmotnosť: 36 g (0.08 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.