IEC/TR 61760-3-1-ed.1.0

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

NORMA vydaná dňa 17.6.2022

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Informácie o norme:

Označenie normy: IEC/TR 61760-3-1-ed.1.0
Dátum vydania normy: 17.6.2022
Počet strán: 26
Približná hmotnosť: 78 g (0.17 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC

Anotácia textu normy IEC/TR 61760-3-1-ed.1.0 :

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.