IEC 63378-2-1-ed.1.0

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

NORMA vydaná dňa 22.10.2024

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Informácie o norme:

Označenie normy: IEC 63378-2-1-ed.1.0
Dátum vydania normy: 22.10.2024
Počet strán: 15
Približná hmotnosť: 45 g (0.10 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC

Anotácia textu normy IEC 63378-2-1-ed.1.0 :

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately. This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.