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IEC 63055-ed.2.0

Format for LSI-Package-Board Interoperable design

NORMA vydaná dňa 11.10.2023

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Informácie o norme:

Označenie normy: IEC 63055-ed.2.0
Dátum vydania normy: 11.10.2023
Počet strán: 292
Približná hmotnosť: 907 g (2.00 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC

Anotácia textu normy IEC 63055-ed.2.0 :

IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.