Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
NORMA vydaná dňa 28.8.2006
Označenie normy: IEC 62258-6-ed.1.0
Dátum vydania normy: 28.8.2006
Počet strán: 9
Približná hmotnosť: 27 g (0.06 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2