Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
NORMA vydaná dňa 11.7.2007
Označenie normy: IEC 62137-1-1-ed.1.0
Dátum vydania normy: 11.7.2007
Počet strán: 30
Približná hmotnosť: 90 g (0.20 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate. La methode dessai decrite dans la CEI 62137-1-1:2007 est applicable aux composants montes en surface, munis dune sortie en aile de mouette. La methode est concue pour soumettre a essai et evaluer lendurance du joint brase entre les broches de raccordements et les plages daccueil sur un substrat, via une contrainte mecanique de type traction. Cet essai permet devaluer les effets de variations repetees de la temperature sur la resistance du joint brase entre les bornes du composant et les plages daccueil sur un substrat.