IEC 62047-25-ed.1.0

Annotation of standard text IEC 62047-25-ed.1.0 :

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology. LIEC 62047-25:2016 specifie la methode dessai in situ pour mesurer la resistance de brasure dune microzone de brasure fabriquee par des technologies de micro-usinage utilisees dans un systeme microelectromecanique (MEMS) a base de silicium. Le present document sapplique a la mesure in situ de la resistance a la traction-compression et de la resistance au cisaillement dune microzone de brasure fabriquee par un processus microelectronique et dautres technologies de micro-usinage.