IEC 61760-1-ed.3.0

Annotation of standard text IEC 61760-1-ed.3.0 :

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD components general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection. L’IEC 61760-1:2020 definit les exigences relatives aux specifications de composants applicables aux composants electroniques destines a etre utilises dans la technique du montage en surface. Elle specifie a cet effet un referentiel compose de conditions de processus et des conditions d’essai associees, a prendre en consideration lors de l’elaboration des specifications de composants. L’objet du present document est de garantir qu’une grande variete de CMS puisse etre soumise a un placement et un montage identiques, ainsi qu’a des processus ulterieurs (par exemple nettoyage, examen) identiques au cours de l’assemblage. Le present document definit les essais et les exigences devant faire partie de toute specification de composant CMS generale, intermediaire ou particuliere. En outre, il propose aux utilisateurs et aux fabricants un referentiel des conditions de processus types utilisees dans la technique du montage en surface. Certaines des exigences du present document relatives aux specifications de composants s’appliquent egalement aux composants a fils destines a etre montes sur une carte de circuit imprime. Une telle applicabilite est alors indiquee dans les paragraphes correspondants. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) ajout de methodes de montage supplementaires: liage par colle conductrice, frittage et connexion sans soudure.