IEC 60749-19-ed.1.1+Amd.1-CSV

Annotation of standard text IEC 60749-19-ed.1.1+Amd.1-CSV :

IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication. La CEI 60749-19:2003+A1:2010 determine la coherence des materiaux et des methodes dessais utilisees pour fixer les pastilles a semiconducteurs aux embases de boitiers ou autres substrats. Cette methode dessai est generalement applicable aux seuls boitiers a cavite ou comme moniteur de processus. Elle nest pas applicable aux surfaces de pastilles superieures a 10 mm2. Elle nest egalement pas applicable aux pastilles a surepaisseur ni aux substrats flexibles. Cette version consolidee comprend la premiere edition (2003) et son amendement 1 (2010). Il nest donc pas necessaire de commander lamendement avec cette publication.