Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Informácie o norme:

Označenie normy: IEC 60191-6-6-ed.1.0
Dátum vydania normy: 22.3.2001
Počet strán: 25
Približná hmotnosť: 75 g (0.17 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC

Anotácia textu normy IEC 60191-6-6-ed.1.0 :

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. La CEI 60191-6-6:2001 fournit les dessins dencombrement et les dimensions courants de tous les types de structures et de materiaux composes des boitiers matriciels a plots et a pas fin (appeles ci-apres FLGA) dont le pas des bornes est inferieur ou egal a 0,80 mm et dont lencombrement du corps du boitier est carre.