Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
NORMA vydaná dňa 27.8.2001
Označenie normy: IEC 60191-6-5-ed.1.0
Dátum vydania normy: 27.8.2001
Počet strán: 10
Približná hmotnosť: 30 g (0.07 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.