Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Informácie o norme:

Označenie normy: IEC 60191-6-22-ed.1.0
Dátum vydania normy: 11.12.2012
Počet strán: 34
Približná hmotnosť: 102 g (0.22 libier)
Krajina: Medzinárodná technická norma
Kategória: Technické normy IEC

Anotácia textu normy IEC 60191-6-22-ed.1.0 :

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA). La CEI 60191-6-22:2012 fournit les dessins dencombrement et les dimensions associees, communs aux structures et materiaux des boitiers en silicium des boitiers matriciels a billes (BGA, ball grid array) et des boitiers matriciels a zone de contact plate (LGA, land grid array).