Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
NORMA vydaná dňa 30.10.2001
Designation standards: IEC 60191-6-1-ed.1.0
Publication date standards: 30.10.2001
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: International technical standard
Kategória: Technické normy IEC
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)