GB/T 44791-2024

Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation

NORMA vydaná dňa 26.10.2024

Anglicky a čínsky -
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The information about the standard:

Designation standards: GB/T 44791-2024
Publication date standards: 26.10.2024
Country: Chinese technical standard
Kategória: Technické normy GB