
Semiconductor devices. Stress migration test standard. Copper stress migration test standard.
NORMA vydaná dňa 21.7.2020
Designation standards: BS IEC 62880-1:2017
Publication date standards: 21.7.2020
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: British technical standard
Kategória: Technické normy BS
ISBN: 978 0 580 85808 6 Status: Definitive