
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA).
NORMA vydaná dňa 4.8.2003
Designation standards: BS EN 60191-6-4:2003
Publication date standards: 4.8.2003
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: British technical standard
Kategória: Technické normy BS
ISBN: 0 580 42356 5 Status: Definitive