Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)

The information about the standard:

Designation standards: ASTM B579-73(2009)
Note: NEPLATNÁ
Publication date standards: 1.9.2009
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Kategória: Technické normy ASTM

Annotation of standard text ASTM B579-73(2009) :

Keywords:
electrodeposited coatings, tin-lead alloy (solder plate), solder, tin-lead alloy, tin-lead, Artificial aging, Bend testing--coatings, Burnishing test--for coating adhesion, Coating adhesion--electrodeposited coatings, Copper alloy electrodeposited coatings, Dip test, Electrodeposited Sn coatings--specifications, Globule test, Iron products (general)--electrodeposited coatings, Lead-tin alloys/coatings--specifications, Printed circuits, Quenching, Reflow test