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ASTM F72-24

Standard Specification for Gold Wire for Semiconductor Lead Bonding

NORMA vydaná dňa 1.4.2024

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Informácie o norme:

Označenie normy: ASTM F72-24
Dátum vydania normy: 1.4.2024
Počet strán: 11
Približná hmotnosť: 33 g (0.07 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM

Anotácia textu normy ASTM F72-24 :

This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.