ASTM F1260-89

Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations

NORMA vydaná dňa 1.1.1989

Anglicky -
Online zabezpečené PDF (71.70 EUR)

Informácie o norme:

Označenie normy: ASTM F1260-89
Poznámka: NEPLATNÁ
Dátum vydania normy: 1.1.1989
Počet strán: 7
Približná hmotnosť: 21 g (0.05 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM

Anotácia textu normy ASTM F1260-89 :

Keywords:
Accelerated aging/testing-semiconductors, Ambient stress temperature, Current-density stress, Defects-semiconductors, Electrical conductors-semiconductors, Electromigration, Failure end point-electronic components/devices, Integrated circuits, Metallization, Microelectronic device processing, Sigma, Silicon-semiconductor applications, Stress-electronic components/devices, Temperature tests-semiconductors, Test structures, Time to failure, Voltage