Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

The information about the standard:

Designation standards: ASTM D5109-99(2004)
Note: NEPLATNÁ
Publication date standards: 10.10.1999
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: American technical standard
Kategória: Technické normy ASTM

Annotation of standard text ASTM D5109-99(2004) :

Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)