Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
NORMA vydaná dňa 10.10.1999
Označenie normy: ASTM D5109-99
Poznámka: NEPLATNÁ
Dátum vydania normy: 10.10.1999
Počet strán: 8
Približná hmotnosť: 24 g (0.05 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM
Keywords:
Copper-clad materials Electrical properties Fiber reinforced polymers Industrial laminate Laminates-electrical insulation Polymers-electrical insulation applications Printed circuits Rigid laminate Thermosetting materials/properties Wiring boards copper-clad laminates-testing, from fiber-reinforced thermosetting polymers for printed wiring boards, Crosswise dimensional instability Dimensional instability Instability Lengthwise d