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ASTM D5109-12

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

NORMA vydaná dňa 1.11.2012

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Informácie o norme:

Označenie normy: ASTM D5109-12
Poznámka: NEPLATNÁ
Dátum vydania normy: 1.11.2012
Počet strán: 9
Približná hmotnosť: 27 g (0.06 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM

Anotácia textu normy ASTM D5109-12 :

Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)