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ASTM B579-73(2009)

Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)

NORMA vydaná dňa 1.9.2009

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Informácie o norme:

Označenie normy: ASTM B579-73(2009)
Poznámka: NEPLATNÁ
Dátum vydania normy: 1.9.2009
Počet strán: 5
Približná hmotnosť: 15 g (0.03 libier)
Krajina: Americká technická norma
Kategória: Technické normy ASTM

Anotácia textu normy ASTM B579-73(2009) :

Keywords:
electrodeposited coatings, tin-lead alloy (solder plate), solder, tin-lead alloy, tin-lead, Artificial aging, Bend testing--coatings, Burnishing test--for coating adhesion, Coating adhesion--electrodeposited coatings, Copper alloy electrodeposited coatings, Dip test, Electrodeposited Sn coatings--specifications, Globule test, Iron products (general)--electrodeposited coatings, Lead-tin alloys/coatings--specifications, Printed circuits, Quenching, Reflow test